Job Description
职位描述：
主导3C产品（计算机/通信/消费电子）连接模块的架构设计与研发；
解决高复杂度硬件互联场景下的性能优化与电磁兼容问题；
协同硬件/软件团队推进从概念到量产的全程技术落地。
任职要求：
电子工程/通信类专业优先，8年+消费电子连接模块设计经验；
精通Wi-Fi/蓝牙/5G等协议及射频电路仿真工具；
具备专利布局或行业标准参与背景优先。
Job application
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